| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic substrate having such a through hole that can make the resistance value of a conductor circuit formed in the through hole as small as possible and can reduce the fluctuation of the resistance value. SOLUTION: Paste 3 for packing is manufactured by mixing the particles 4 of at least one kind of conductive material selected from among the carbides of tungsten, molybdenum, tantalum, and niobium, at least one kind of dispersing solvent selected from amongα-terpineol, butyral, and glycol, and at least one kind of dispersant selected out of anionic dispersants and nonionic dispersants together. The paste 3 contains the dispersing solvent and dispersant at rates of 2-10 pts.wt. and 0.1-2.0 pts.wt., respectively, to 100 pts.wt. conductive particles. A ceramic substrate is manufactured by baking an aluminum nitride green sheet 1 having a premade hole for forming through hole after the hole 2 is filled up with the paste 3.
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