Chip card module manufacture comprises adhering leadframe set to surface of semiconductor wafer and electrically connecting to contact bumps before separation of individual chip card modules

摘要

The chip card module manufacturing element has the rear surface of a semiconductor wafer provided with a metallization or contact bumps. The bumps are aligned with the bond pads for connecting each chip card module with an antenna coil, before positioning a leadframe set so the metallization or contact bumps are uncovered and an adhesive coating applied to the leadframe set is hardened to secure it to the semiconductor wafer. The latter is then separated into the individual chip card modules along defined separation lines after electrically connecting the leadframes to the metallization or contact bumps. Also included are Independent claims for: (a) a positioning device for chip card manufacture; and (b) a positioning method for chip card manufacture.