| 摘要 |
The wafer has several dividing lines (DXa,b) extending in a first direction with first spacing, and second dividing lines (DYa,b) extending in a second orthogonal direction with a second spacing. The two dividing lines separate a semiconductor component region (CR1,2). The first dividing lines have alternating first and second widths (La,b), with the second width larger than the first one. The second dividing lines have alternating third and fourth widths (La,b), with the fourth width larger than the third one. An Independent claim is included for the semiconductor component.
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