发明名称 Heat sink device for semiconductor elements or electric motor has extruded lightweight metal base profile provided with projecting spaced cooling ribs
摘要 The heat sink device has an extruded base profile (1.1) made of a lightweight metal, with a number of spaced cooling ribs (1.2) projecting from the base profile in a direction which is perpendicular or at an angle to the direction of extrusion of the base profile, in thermal contact with the base profile. The cooling ribs can fit into respective locating grooves provided in the base profile. An Independent claim is also included for the production of a heat sink device.
申请公布号 DE19830512(A1) 申请公布日期 2000.04.20
申请号 DE1998130512 申请日期 1998.07.09
申请人 GLUECK, JOACHIM 发明人 GLUECK, JOACHIM
分类号 F28F3/02;H01L21/48;H01L23/367;H05K7/20;(IPC1-7):H01L23/367 主分类号 F28F3/02
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