| 摘要 |
PROBLEM TO BE SOLVED: To reduce losses in optical connections and to improve optical coupling efficiency by forming a polymer waveguide integrally with an optical switch and a light receiving element. SOLUTION: An intercoupling substrate 10 includes both inter-chip connections and intra-chip connections for signals from one or more IC chips 1a to 1d using both optical links and electrical paths. The substrate 10 includes a base substrate 12 and an activated layer 20. The layer 20 includes optical waveguides 24a to 24b, photoelectron switching devices 26a to 26c, light receiving devices 28a to 28c, electrical paths 30, and electrical connection pads 32 for the chips 1. The waveguides 24 and the devices 26 and 28 are preferably embedded in the layer 20. Signals between chips are electrically propagated through the paths 30, or optically propagated through the waveguides 24. When a signal is propagated through a waveguide 24 by means of light, the devices 26 and 28 perform a conversion between an optical representation and an electrical representation of the signal. |
