Gerät zum Polieren von Wafers

摘要

An apparatus 1 for polishing wafers W comprising a turn table 3 with a polishing pad 2 fixedly extended thereon, at least one polishing head 4 positioned above a point on the turn table 3 spaced by a distance from its center, a plate 7 mounted on a lower surface of the at least one polishing head 4, and a carrier 6, which is used for retaining the wafers W, mounted on the plate 7 in a manner such that the carrier 6 is freely rotatable relative to the plate 7, wherein a backing pad 12 which is used to press the wafers W is fixed on the plate 7 and the wafers W are rotated around their respective centers, while being revolved around the center of the plate 7. According to the apparatus 1, polished wafers W with an excellent flatness are obtained in a reliable manner.