| 摘要 |
A semiconductor component includes a housing (10) and at least one integrated electronic circuit (20) located within the housing. Conductor paths (30,60) are arranged in at least one plane for connection of the integrated electronic circuit. Between adjacent conductor paths and/or between shoulders (35,36) of the conductor paths (30) are formed recesses (70), in which the recesses are at least partly filled with a composite material and are specifically filled with composite material such as SOJ, and TSOP. More specifically, the recesses extend along an inner edge zone (40) of the housing. |
