Micromechanical device, especially an oscillating mirror, is produced by electrodepositing a device element onto a quasi-insular attachment region and an adjacent region of a bond layer

摘要

Micromechanical device production process comprises electrodeposition of a device element onto a quasi-insular attachment region (132) and an adjacent region (133) of a bond layer. Production of a micromechanical device, having a substrate attachment region (132) for fixing a device element (35) located above the substrate (10), comprises: (a) providing the substrate with a bottom region (20) for receiving the attachment region (132); (b) forming and structuring a bond layer on the substrate (10) so that the attachment region (132) is formed as a quasi-insular region within an opening in the bond layer as is connected merely by a thin web with the rest of the bond layer; (c) covering the bond layer with a structured mask which exposes the attachment region (132) and an adjacent overgrowth region (133); (d) electroplating a layer (35) onto the non-masked attachment region (132) such that the layer grows over the adjacent overgrowth region (133); and (e) removing the mask and the non-overgrown part of the bond layer.