SANDBLASTING AGENT, WAFER TREATED WITH THE SAME, AND METHOD OF TREATMENT WITH THE SAME

摘要

A sandblasting agent which can prevent fouling by metal ions; and a method of sandblasting a silicon wafer with the agent. The method comprises using a sandblasting agent containing a chelating agent. The chelating agent is selected, for example, among the following (1) to (4) and salts of these. (1) Nitrilotriacetic acid (NTA); (2) Ethylenediaminetetraacetic acid (EDTA); (3) Diethylenediamine-N,N,N'',N''-pentaacetic acid (DTPA); (4) Cyclohexanediaminetetraacetic acid (CyDTA).