发明名称 SENSOR WITH DIAPHRAGM SENSOR CHIP
摘要 <p>An acceleration sensor with a diaphragm sensor chip (6) has lead frames (3). One of the lead frames (3) has a die pad (4). The sensor chip (6) is flexibly adhered to the die pad (4) by adhesive (10). The sensor chip (6) has a diaphragm (6b). The sensor chip (6) outputs signals in accordance with flexure of the diaphragm (6b). The lead frames (3) are molded by a mold member (2). The mold member (2) define a space (8a) about the sensor chip (6). The coefficient of linear expansion of the mold member (2) is between 1.4x10<-5>/ DEG C and 1.8x10<-5>/ DEG C, and the modulus of elasticity of the mold member (2) is between 100x10<3>kg/cm<2> and 130x10<3>kg/cm<2>. Use of the mold member (2) minimizes the ratio of change of sensitivity due to temperature changes, which improves the temperature characteristics of the sensor. <IMAGE></p>
申请公布号 EP0994357(A1) 申请公布日期 2000.04.19
申请号 EP19980929812 申请日期 1998.07.02
申请人 KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO 发明人 IWATA, HITOSHI;KANBE, MASAKATA
分类号 G01P21/00;G01P1/00;G01P1/02;G01P15/12;H01L23/29;H01L23/31;(IPC1-7):G01P15/12 主分类号 G01P21/00
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