| 发明名称 |
Semiconductor device and semiconductor device module |
| 摘要 |
A semiconductor device (10A) includes a semiconductor chip (12), connection parts (18) arranged along one end of the semiconductor chip (12), and external connection terminals (16A) connected to the connection parts (18). <IMAGE> |
| 申请公布号 |
EP0883174(A3) |
申请公布日期 |
2000.04.19 |
| 申请号 |
EP19980300242 |
申请日期 |
1998.01.14 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
FUJISAWA, TETSUYA;SATO, MITSUTAKA;MITOBE, KAZUHIKO;HAYASHIDA, KATSUHIRO;SEKI, MASAAKI;ORIMO, SEIICHI;HAMANO, TOSHIO |
| 分类号 |
H01L21/60;H01L23/28;H01L23/31;H01L23/495;H01L23/50 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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