发明名称 |
Semiconductor device fabrication using a sacrificial plug for defining a region for a gate electrode |
摘要 |
A semiconductor device is formed by forming a sacrificial plug over a substrate and forming active regions in the substrate adjacent the sacrificial plug. A film is then formed over portions of the substrate adjacent the sacrificial plug. The sacrificial plug is then selectively removed leaving an opening in the film, and a gate electrode is formed in the opening. The sacrificial plug can be formed from several materials including, for example, polysilicon and nitrogen-bearing species such as nitride. The gate electrode may, for example, be formed from temperature-sensitive metals such as copper since the gate electrode may be formed subsequent to high temperature steps of the fabrication, such as a source drain anneal, for example.
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申请公布号 |
US6051487(A) |
申请公布日期 |
2000.04.18 |
申请号 |
US19970993612 |
申请日期 |
1997.12.18 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
GARDNER, MARK I.;FULFORD, H. JIM;GILMER, MARK C.;PAIZ, ROBERT |
分类号 |
H01L21/28;H01L21/336;H01L29/49;H01L29/51;(IPC1-7):H01L21/320 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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