发明名称 TRANSFER METHOD
摘要 PROBLEM TO BE SOLVED: To expand the range of transfer conditions by improving the adhesiveness of a transfer layer and enabling a low temperature transfer. SOLUTION: In a transfer method wherein when an adhesive layer A formed on a base material B is in heated conditions, a transfer sheet S comprising a supporter sheet 1 and a transfer layer 2 is pressed against the material B, immediately after which or after these materials are cooled the supporter sheet 1 is peeled off, the adhesive layer is such that a reactive plasticizer having a functional group containing active hydrogen is added to a two-part curing urethane resin which is composed of a main agent of polyol and a crosslinking agent of isocyanate and is solid at room temperatures in its uncured state, and the glass transition temperature of the reactive plasticizer is made lower than that of the main agent. Contact bonding of the transfer sheet is performed before the adhesive layer is fully cured, and the adhesive layer is cured completely before or after the supporter sheet is peeled off.
申请公布号 JP2000108595(A) 申请公布日期 2000.04.18
申请号 JP19980283915 申请日期 1998.10.06
申请人 DAINIPPON PRINTING CO LTD 发明人 SUGA REIKO
分类号 B44C1/17;B32B27/40;(IPC1-7):B44C1/17 主分类号 B44C1/17
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