发明名称 SURFACE TREATMENT METHOD BY DC ARC DISCHARGE PLASMA
摘要 PROBLEM TO BE SOLVED: To provide a surface treatment method of arc discharge plasma capable of treating only an objective region on a substrate and complying with an enlarged treatment area with a simple means. SOLUTION: In a method in which gas 2 for discharge and for treatment is supplied between two electrodes 1 to impress DC voltage, a surface treatment is conducted using the plasma with arc discharge generated between electrodes, the surface treatment is conducted by a method in which a plasma generating source is moved for a fixed substrate 3 or a method in which the plasma generating source is fixed and a substrate side is moved.
申请公布号 JP2000109979(A) 申请公布日期 2000.04.18
申请号 JP19980282521 申请日期 1998.10.05
申请人 OKUI TOKUJIRO 发明人 OKUI TOKUJIRO
分类号 H05H1/24;C23C16/27;C23C16/50 主分类号 H05H1/24
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