发明名称 PROTECTING MEDIUM FOR HEAT-SENSITIVE TRANSFER IMAGE
摘要 PROBLEM TO BE SOLVED: To provide a mold release layer with an appropriate adhesion to a base material, good peeling properties, a sufficient heat resistance and the like by laminating a mold release layer, a protecting layer and an adhesive layer in that order on one of the faces of the base material and forming the mold release layer of the ionomer resin of a fluorine-modified acrylic resin. SOLUTION: The protecting medium for a heat-sensitive transfer-recorded image is composed of a mold release layer 2, a protecting layer 3 and an adhesive layer 4 laminated in that order on a base material 1. The base material 1 is of a film such as polyester or polypropylene. The mold release layer 2 is made of the ionomer resin of a fluorine-modified acrylic resin. In addition, the protecting layer 3 is made of an acrylic resin or the like which is highly chemical-resistant and light-resistant and the adhesive layer 4 is made of a thermoplastic resin such as polyester which becomes adhesive by heat. The mold release layer 2 imparts a sufficient adhesion to the base material 1 and releases the adjacent protecting layer 3 properly. Further, the mold release layer 2 enables the protecting layer 3 and the adhesive layer 4 to be easily applied in a lapping manner when these layers are laminated.
申请公布号 JP2000108526(A) 申请公布日期 2000.04.18
申请号 JP19980281836 申请日期 1998.10.02
申请人 TOPPAN PRINTING CO LTD 发明人 OCHIAI HIDEKI;ISHIGURO MASA;ITO YUKIO
分类号 B41M5/382 主分类号 B41M5/382
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