| 摘要 |
<p>PROBLEM TO BE SOLVED: To efficiently manufacture a printed-wiring board which is almost free from warpage, distortion or dimensional change and is of high wiring density. SOLUTION: In this method for manufacturing a metallic foil-applied laminate, a single piece or a plurality of pieces of adhesive sheet or prepreg are superposed and a metallic foil is further superposed on the outer surface thereof, thermally pressed and laminated so as to integrate them. In this case, the kind of the adhesive sheet or the prepreg and a mirror plate is selected so that the difference between a coefficient of average linear expansion between a highest and a lowest temperature at the time of lamination of the laminated sheet or a prepreg cured product and a coefficient of average linear expansion between a highest temperature and a lowest temperature at the time of lamination of the mirror plate is 3×10-6/ deg.C or less.</p> |
