发明名称 WORK PLATE OF WIRE SAW AND WORKPIECE CUTTING METHOD USING THE WORK PLATE
摘要 PROBLEM TO BE SOLVED: To suppress thermal deformation and camber of a cut workpiece by a simple structure by forming a work plate holding the work piece by using a low heat expanding material. SOLUTION: A work plate 42 is formed of a low heat expanding material, that is, an invar alloy, for instance. In the work plate 42 during a cutting, a temperature is raised by heat generation due to the friction of traveling wire and ingot 32. Because heat can not be radiated via a cylinder rod 48 and a work holder 44 like at both the ends, at a center part of the work plate 42, in particular, a temperature becomes high. However, because the work plate 42 is formed by the invar alloy, a substantially fixed shape of the work plate 42 can be kept, even if the temperature of the work plate 42 is raised and deviation is generated in a temperature distribution. As a result, the camber of wafer and an angle error of a cut surface according to thermal deformation of the work plate 42 can be eliminated and cutting accuracy of wafer can be improved.
申请公布号 JP2000108009(A) 申请公布日期 2000.04.18
申请号 JP19990134681 申请日期 1999.05.14
申请人 TOKYO SEIMITSU CO LTD;NSC ELECTRON CORP 发明人 TAKAI NOZOMI;YAMAMOTO SEIJI;YOSHIDA YUICHI;MIURA AKIRA
分类号 B24B27/06;B28D5/04;(IPC1-7):B24B27/06 主分类号 B24B27/06
代理机构 代理人
主权项
地址
您可能感兴趣的专利