| 摘要 |
PROBLEM TO BE SOLVED: To provide liquid sealing resin compositions which improve the thermal conductivity of resins and can cope with large-sized packages of semiconductor chips and the like. SOLUTION: Liquid sealing resin compositions comprise (A) an epoxy resin of the bisphenol A type, the glycidyl ester type or the like, (B) an epoxy resin curing agent such as methyl-tetrahydrophthalic anhydride and a cresol novolak phenol resin, and (C) a silicon nitride powder having an appropriate particle diameter such as an average particle diameter of 5μm as the essential components.
|
