| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus of reduced variation in a cavitation area by ultrasonic waves and to attempt the uniform treatment of the substrate. SOLUTION: A substrate cleaning apparatus 1 is equipped with a cleaning bath 2, a boundary plate 7, and an ultrasonic oscillator 8. In the cleaning bath 2, a cleaning liquid is stored, and a substrate W to be cleaned is placed. The boundary plate 7 is interposed between the cleaning liquid in the cleaning bath 2 and an atmosphere above the solution 2. The ultrasonic oscillator 8 emits ultrasonic waves toward the boundary plate 7.
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