发明名称 |
Wafer securing device and method |
摘要 |
A wafer securing device and method for securing a planar plate on a wafer having a hollowed-out portion, the device including a substrate for receiving the wafer; a groove provided on the substrate and having an opening, the hollowed-out portion corresponding to the groove when the wafer is placed on the substrate; and an air extracting equipment for extracting air from the groove when the wafer is placed on the substrate so that the planar plate placed on the wafer is secured to the wafer by means of a vacuum suction force.
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申请公布号 |
US6051067(A) |
申请公布日期 |
2000.04.18 |
申请号 |
US19980064624 |
申请日期 |
1998.04.23 |
申请人 |
MICROJET TECHNOLOGY CO., LTD. |
发明人 |
MOU, MICHAEL;CHUANG, BILL YUAN CHUNG;YANG, ARNOLD CHANG MOU;HO, JING YUANG |
分类号 |
B25B11/00;H01L21/683;(IPC1-7):B05C13/00 |
主分类号 |
B25B11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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