THERMALLY CONDUCTIVE RESIN MOLDING, ITS MANUFACTURE AND USE

摘要

PROBLEM TO BE SOLVED: To manufacture a highly flexible and highly thermally conductive heat dissipation member with good productivity by forming the member out of a resin molding which contains a thermally conductive filler and is easily deformed by an external force and forming it in a structure having communicating holes. SOLUTION: The thermally conductive resin molding 1 is a molding containing thermally conductive filler 3 in a resin 2 or a resin molding to be easily deformed by an external force and containing communicating holes 4. The filler 3 contains BN particles. The resin 2 is a silicon. A shape of the molding is sheet-like. The holes 4 are formed in a thickness direction of the sheet with a porosity of a range 5 to 50%. Further, a ratio of the particles oriented in the thickness direction of the sheet is increased more than that of the particles oriented in a width direction of the sheet. Such the molding 1 is obtained by molding an uncured bar-like mold by using a resin composition containing the filler 3, providing air gaps to become a plurality of the holes 4, and accumulated. Thereafter, it is cut and cured.