| 摘要 |
PROBLEM TO BE SOLVED: To stably ensure the uniformity of the sputter film sheet resistance in a substrate surface for a long time by specifying a gap between an end part and a lower surface of a substrate, and providing a counter sunk part in an area other than the end part. SOLUTION: A wafer stage cover 2 is provided to prevent a sputter film from being adhering to a stage 4. A counter sunk part 5 is provided on a center part of the stage cover 2. In the counter sunk part 5, the gap between a lower surface of a wafer 1 and the wafer stage cover 2 is <=1/200 of the short side or the diameter. In the counter sunk part 5, the gap between the substrate and the stage cover for the full surface sputter is >=1.5 time that at the end part. Since the counter sunk part 5 is present, the wafer stage cover 2 is not brought into contact with the wafer 1 even when the curved wafer stage cover 2 is installed on the stage, and the wafer is placed thereon, and the uniformity in the wafer surface of the sputter film formed on the wafer 1 can be ensured.
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