| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition excellent in moldability and reliability, capable of affording molding materials with extremely low warpage, and useful for sealing semiconductor devices by including a specific epoxy resin, a specific naphthol-based curing agent, a curing promoter and a specified amount of an inorganic filler. SOLUTION: This composition is obtained by essentially compounding (A) an epoxy resin of formula I ((n) is 0-6; R1 and R2 are each H or a 1-10C alkyl), (B) a naphthol-based curing agent of formula II ((l), (m) and (n) are each >=0), (C) a curing promoter (pref. e.g. an adduct of triphenylphosphine to benzoquinone), and (D) an inorganic filler such as fused silica of 85-95 wt.% based on the whole composition, wherein the component B can be prepared, for example, by reflux reaction between 1-naphthol, phenol and formaldehyde at about 100 deg.C for 1-8 h or so followed by temperature rise up to 120-180 deg.C in the presence of a strong acid such as hydrochloric acid while extracting the water in the system and then continuing the condition for 2-24 h.
|
