发明名称 Thin film forming apparatus
摘要 There is provided a thin film forming apparatus in which plasma of high frequency is made of raw material gas in a film forming chamber 7, a thin film is formed on a surface of a substrate 12 in the film forming chamber 7 by the plasma of high frequency, and a characteristic of the thin film is controlled by irradiating ion beams 4 onto the surface of the substrate 12 at the same time, characterized in that: the substrate 12 is composed of a square plate having a regular square surface or a rectangular surface; and the thin film forming apparatus is provided with a high frequency electrode 13 for forming the plasma of high frequency into a cube or a rectangular parallelepiped to cover an overall surface of the substrate 12, on the surface side of the substrate 12.
申请公布号 US6051120(A) 申请公布日期 2000.04.18
申请号 US19980198584 申请日期 1998.11.24
申请人 NISSIN ELECTRIC CO., LTD. 发明人 KISHIDA, SHIGEAKI;MIKAMI, TAKASHI;KIRIMURA, HIROYA;OGATA, KIYOSHI
分类号 C23C14/32;C23C16/50;C23C16/505;H01J37/32;H01L21/205;H01L21/31;(IPC1-7):C23C14/46 主分类号 C23C14/32
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