| 摘要 |
PROBLEM TO BE SOLVED: To obtain a material for a thermosetting resin having an excellent heat resistance and hardly causing crack and peeling by mixing a polyaddition- type thermosetting resin and a curing agent for the resin with a specific silane analogue. SOLUTION: This material comprises (A) a polyaddition-type thermosetting resin and (B) a compound of formula I or II [R is an organic group containing a functional group causing an addition reaction with a curing agent for the component A; R1-R6 are each silicon-containing group having 0-3 (SiRO3/2 as a repeating unit], and moreover (C) the curing agent for the component A is mixed. In order to obtain the resin material, firstly a liquid mixture of the component B, water and a catalyst for hydrolysis is prepared. After the component A is added to the liquid mixture, the resulting mixture is treated with heat preferably at 60-160 deg.C for 1-10 hrs. Consequently, the curing agent is added to the heat-treated liquid mixture to give the objective material for the thermosetting resin. A thermosetting resin molding product (e.g. semiconductor device or the like) can be obtained by injecting the resin material into a molding die and during it with heat. |
