发明名称 SYNTHETIC RESIN SUPPLYING DEVICE
摘要 PROBLEM TO BE SOLVED: To carry a synthetic resin cut off from an extrusion nozzle being held as it is to a compression molding device. SOLUTION: This device supplies a synthetic resin 100 extruded from an extrusion nozzle 2 to a compression molding device. In this case, this device is equipped with cutting and holding mechanisms 200, which are carried so as to pass through an accepting position opposing to the extrusion nozzle 2 and a discharging position locating opposite to the required part of the compression molding device. The cutting and holding mechanism 200 includes a cutting means for cutting the synthetic resin 100 extruded through an extrusion opening 2a at its carrying through the accepting position and a holding means for selectively holding the synthetic resin 102 to be cut with the cutting means.
申请公布号 JP2000108127(A) 申请公布日期 2000.04.18
申请号 JP19980281573 申请日期 1998.10.02
申请人 UENO HIROSHI 发明人 ETO MAKOTO;KAWAGUCHI KIYOSHI
分类号 B29B11/12;B29C31/04;B29C43/08;B29C43/34;B29C49/02;(IPC1-7):B29C31/04 主分类号 B29B11/12
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