发明名称 Process for fabricating semiconductor device
摘要 A process for fabricating a semiconductor device comprising the step of, after patterning the silicon film crystallized to a low degree by thermally annealing an amorphous silicon film into an island by etching, irradiating an intense light of a visible light or a near infrared radiation to effect a short-period annealing (RTA) to the silicon film of low crystallinity. Thus, the crystallinity of the silicon film is improved and the silicon film is densified in a short-period.
申请公布号 US6051453(A) 申请公布日期 2000.04.18
申请号 US19960707580 申请日期 1996.09.05
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 TAKEMURA, YASUHIKO
分类号 H01L21/336;H01L21/20;H01L21/77;H01L21/84;H01L29/786;(IPC1-7):H01L21/84 主分类号 H01L21/336
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