| 摘要 |
PURPOSE: A method for identifying wire bonding status of semiconductor package is provided to reduce manhour due to the elimination of examination with the naked eye of an operator, thereby to completely remove the failure rate. CONSTITUTION: A method for identifying wire bonding status of semiconductor package comprises a step mounting an operating device(16) within a wire bonder(10), a step embedding a golden memory disk(14) to be separated, a step starting wire bonding operation, a step inputting the coordinate values of the wire bonder into the operating device(16), and a comparing and identifying step. In the comparing and identifying step, the coordinate values of the bonding memory disk(12) are compared with coordinate values of the golden memory disk(14) in the operating device(16). |
