发明名称 |
CLAMP USED IN SPUTTERING APPARATUS |
摘要 |
PURPOSE: A clamp prevents a supporting part of the clamp from contacting with a side of a wafer. CONSTITUTION: A clamp(110) prevents to contact with a wafer(112) after sputtering process by changing the structure of the clamp fixing the wafer placed on a heating plate(114). The wafer is heated after fixed by the clamp, and placed on the heating plate in a reactor for performing the sputtering process. The clamp comprises a cylindrical supporting part(116) projected vertically on one side of a ring-shaped circular plate. The inside diameter of the supporting part is larger than the diameter of the wafer by more than 1 mm.
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申请公布号 |
KR20000019585(A) |
申请公布日期 |
2000.04.15 |
申请号 |
KR19980037761 |
申请日期 |
1998.09.14 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KWUN, KI HOON;HONG, DONG PYO;YOON, TAE JIN;KO, YEOUNG HAK |
分类号 |
H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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