发明名称 CLAMP USED IN SPUTTERING APPARATUS
摘要 PURPOSE: A clamp prevents a supporting part of the clamp from contacting with a side of a wafer. CONSTITUTION: A clamp(110) prevents to contact with a wafer(112) after sputtering process by changing the structure of the clamp fixing the wafer placed on a heating plate(114). The wafer is heated after fixed by the clamp, and placed on the heating plate in a reactor for performing the sputtering process. The clamp comprises a cylindrical supporting part(116) projected vertically on one side of a ring-shaped circular plate. The inside diameter of the supporting part is larger than the diameter of the wafer by more than 1 mm.
申请公布号 KR20000019585(A) 申请公布日期 2000.04.15
申请号 KR19980037761 申请日期 1998.09.14
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KWUN, KI HOON;HONG, DONG PYO;YOON, TAE JIN;KO, YEOUNG HAK
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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