| 摘要 |
PURPOSE: An epoxy resin composition is provided which has a good crack resistance, excellent molding property and reliability when semiconductor device is mounted on surface. CONSTITUTION: The epoxy resin composition having more than 0.5 poise of viscosity, more than 50°C of softening point as an ortho-cresol novolac resin or mixed with low molecular resin comprises 10-100 % of a phenol resin(formula 1; R1 is H, C1-C5 alkyl or phenyl group; R2 is H, C1-C5 alkyl, phenyl or limonene; R3 is methyl, dicyclopentadiene, xylene or dimethyl biphenyl) and more than one compound selected from inorganic filler, coupling agent, hardening accelerator, plasticizer, flame retardant, releasing agent and coloring agent. Thus, 8.37 weight parts of epoxy resin, 1.14 weight parts of organic flame retardant and 5.69 weight parts of hardening agent are mixed to give the epoxy resin composition. |
