| 摘要 |
PURPOSE: A slurry supply system of semiconductor CMP(chemical mechanical polishing) equipment is provided to prevent a wafer from being scratched. CONSTITUTION: A slurry supply system of semiconductor CMP equipment comprises a slurry drum(10,110) storage for storing the drums of slurry, a slurry supplying line, a blend supplying line, a blend vessel, a blend storage(20), and pumps(23,24). The blend supplying line is supplied with the slurry solution and water, and two solution are blended in the line. The blend is supplied from the blend storage to the CMP equipment. The pump mounted on the slurry supplying line within the drum storage to generate pressure difference, thereby feeding the slurry toward the blend vessel.
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