PURPOSE: A KGD(known good die) is provided to use a prior test socket and to reduce the fabrication cost of the KGD. CONSTITUTION: A KGD carrier connects a semiconductor chip(110) to a test socket electrically in order to be applied in carrying an individual semiconductor chip or in electrical function test and burn-in test. BGA(Ball Grid Array) solder balls(150) are formed on the bottom surface of a film(130) where the semiconductor chip is mounted or a structure of the KGD carrier including a clip lead contacting the top/bottom surface of the substrate. Through the above structure, an additional cost is prevented and further the fabrication cost of the KGD is reduced by applying the KGD in the prior test socket.
