| 摘要 |
PURPOSE: A socket for testing a ball grid array package is provided to allow improvement in aligning and contact properties. CONSTITUTION: The socket includes a lower base(1), an upper base(2) coupled to the lower base(1) and having contact holes(5) for receiving solder balls(4) of the package(3) during an electrical test of the package(3), a guide member(6,7) facilitating a right placement of the package(3), a plurality of contact pins(12) contacted with the solder balls(4) during the test, and an elastic member(10,13) for acting as a buffer between the socket and the package(3). The guide member has the first guide pin(6) formed on corners of the upper base(2) to direct the package(3), and the second guide pin(7) formed between the adjacent contact holes(5) to direct the solder balls(4) into the contact holes(5). The elastic member has the first spring(10) formed between a fixing pin(9) in the lower base(1) and a corresponding hole(8) in the upper base(2), and the second spring(13) formed under the contact pins(12) for providing a restoring force thereto.
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