SPINDLE FORK ASSEMBLY IN SEMICONDUCTOR MANUFACTURING DEVICE

摘要

PURPOSE: A spindle fork assembly of a manufacturing apparatus of a semiconductor device is provided to easily align the spindle fork assembly with a fork groove formed in a heater block by decreasing the horizontal width of the spindle fork and prevent a defect of a wafer by preventing particles generated by friction between the spindle fork and the fork groove. CONSTITUTION: A spindle fork assembly of a manufacturing apparatus of a semiconductor device comprises: a rotating plate equipped with a spindle fork on which a wafer is mounted so that the wafer moves to a process position on a heater block for heating the wafer during a manufacturing process of the wafer, the heater block being established in a process chamber; and a spindle unit for rotating and elevating the rotating plate in a predetermined angle. The spindle fork is characterized by the horizontal width from 5.0 to 7.5 millimeters.