发明名称 |
METHOD OF MANUFACTURING RAISED SOURCE/DRAIN OF TRANSISTOR |
摘要 |
PURPOSE: A method of manufacturing raised source/drain of a transistor is provided to minimize an area of a substrate when applying silicide to shallow source/drain regions. CONSTITUTION: A method of manufacturing raised source/drain comprises the steps of: forming a gate electrode layer composed of sequentially multi-laying a gate electrode and a gate mask; forming a spacer on both side walls of the gate electrode layer; forming source/drain regions by injecting impurity ions into both sides of the gate spacer on a semiconductor substrate; forming a silicon epitaxial layer on the source/drain regions on both sides of the gate spacer; and silicidying all of the silicon epitaxial layer.
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申请公布号 |
KR20000020330(A) |
申请公布日期 |
2000.04.15 |
申请号 |
KR19980038891 |
申请日期 |
1998.09.19 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KANG, U TAK |
分类号 |
H01L21/24;(IPC1-7):H01L21/24 |
主分类号 |
H01L21/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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