METHOD OF MANUFACTURING SPUTTERING TARGET FOR MAKING SEMICONDUCTOR

摘要

PURPOSE: A method of manufacturing a sputtering target for making a semiconductor is provided to control uniformity and size of crystalline particles inside a target by performing a rolling in a direction perpendicular to the direction of the prior rolling in every pass. CONSTITUTION: A method of manufacturing a sputtering target for making a semiconductor comprises the steps of: forming a nugget by vacuum-melting and casting an alloy; homogenizing the inter structure of the nugget; forming rolling material by repeatedly performing a rolling in various direction in every pass; performing a heat treatment of the rolling material; and manufacturing a sputtering target by the after-treatment of the heat-treated rolling material.