发明名称 A LEAD STRUCTURE FOR CHIP CONNECTION
摘要 A lead structure includes an insulating film, a plurality of leads, and a plurality of adhesive layers separately provided on the insulating film. Two adjacent leads are fixed by adjacent adhesive layers, respectively, such that an adhesive does not exist on the insulating film between the adjacent adhesive layers. Therefore, ion migration between the leads through the adhesive layer can be prevented.
申请公布号 KR100251330(B1) 申请公布日期 2000.04.15
申请号 KR19970022158 申请日期 1997.05.30
申请人 NEC CORPORATION 发明人 MATSUTOMO, MITSUHIRO
分类号 H01L23/495;(IPC1-7):H01L23/448 主分类号 H01L23/495
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