发明名称 COATING APPARATUS OF LEAD FRAME
摘要 PURPOSE: A coating apparatus for a lead frame is provided to allow a simplified process of coating the lead frame for die bonding without oxidation of the lead frame. CONSTITUTION: In the apparatus, the lead frames(11) stacked in a lead frame supply unit(10) are transferred one by one to a paste coating table(31) of a fixing unit(30) by a transfer unit(20) having a vacuum pickup tool(21), and then fixed on the table(31) by a vacuum pump(32). Next, a portion of the lead frame(11) is coated with paste applied by a paste supply unit(50). The paste-coated lead frame(11) is then shifted to a conveyor rail(41) of a conveyance unit(40) by the transfer unit(20), and moved into a magazine(62) in a preheater(61) along the conveyor rail(41) by a pusher(42). Next, the lead frame(11) is supplied to a magazine(71) in a stocker(70).
申请公布号 KR100252316(B1) 申请公布日期 2000.04.15
申请号 KR19970055609 申请日期 1997.10.28
申请人 SAMSUNG ELECTRONICS CO, LTD. 发明人 KIM, SEONG-BONG
分类号 H01L21/52;(IPC1-7):H01L21/52 主分类号 H01L21/52
代理机构 代理人
主权项
地址