CHIP SCALE SEMICONDUCTOR PACKAGE USING RIGID-FLEX PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A chip scale semiconductor package using a rigid-flexible PCB and a manufacturing method thereof are provided to allow a multiple pin configuration and to reduce package size. CONSTITUTION: The package(1) is manufactured by using the PCB having a flexible circuit substrate and a pair of rigid circuit substrates(32). The flexible substrate has a resin film(31'), a circuit pattern(33) formed on the resin film(31'), and conductive traces(331) extended from the circuit pattern(33) and bent toward bond pads(21) on a semiconductor chip(2) for electrically direct connection. The rigid substrates(32) are attached above and below a central part of the flexible substrate. The semiconductor chip(2) is mounted to the upper rigid substrate(32) through an adhesive(4) and molded in a resin encapsulant(5). In addition, solder balls(6) are mounted to ball pads(34) formed under the lower rigid substrate(32).