PRINTED CIRCUIT BOARD HAVING PLURALITY OF INTEGRATED CIRCUIT CHIPS AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A method for mounting a plurality of chips on a printed circuit board is provided to be capable of configuring a large system in a three dimension. CONSTITUTION: A method for mounting a plurality of chips on a printed circuit board comprises the steps of: preparing a plurality of integrated circuit chips in which bumps(105) are formed at pads(104), and a printed circuit board(101) in which a plurality of electrodes are formed; forming an isotropic conductive film(103) on the printed circuit board; and aligning the pads so as to be overlapped at the electrodes to then adhere the pads and the electrodes by pressing under a predetermined temperature.