METHOD FOR MANUFACTURING MICRO BALL GRID ARRAY PACKAGE

摘要

PURPOSE: A method for manufacturing a micro ball grid array package is provided to minimize a gap between a carrier and a tap tape. CONSTITUTION: A manufacturing method of a micro ball grid array package comprises the steps of: cutting a tap tape(123) with a predetermined conductive pattern formed on one side thereof in strip form; forming a slot or a through hole in the tap tape and putting it on upper surface of a carrier(124); and adhering the tap tape to the carrier by coating an adhesive in the slot or the through hole. Thereby, the tap tape is easily adhered on the upper surface of the carrier, so that a gap between the carrier and the tap tape adhered to the upper surface thereof is minimized.