| 摘要 |
A semiconductor package and semiconductor device are provided which enable manufacturing of same with ease of inspection, good reliability, and good thermal characteristics. An insulator made of an organic material and a wiring pattern formed by a metallic foil are formed on top of a metallic base substrate, thereby forming a laminated structure. The metallic base substrate has a plurality of electrically insulated continuity checking terminals. The metallic base substrate, the continuity checking terminals, and the wiring pattern are connected by via holes which pass through the insulator at prescribed locations. The insulator and wiring pattern is removed at a prescribed location at which a semiconductor chip is to be mounted. The exposed metallic base substrate is formed as a cavity of a prescribed depth. |
