发明名称 LCD DRIVER IC FOR REDUCING CONTACT RESISTANCE BETWEEN CONDUCTIVE FILM PATTERN OF CHIP ON GLASS AND BUMP PAD, AND CHIP ON GLASS MODULE HAVING LCD DRIVER IC
摘要 <p>PURPOSE: An LCD drive IC is provided which reduces contact resistance between bump pad and conductive pattern of chip on glass to prevent driving signal applied to external terminal connected to the LCD drive IC from distorting. CONSTITUTION: An LCD drive IC(31) comprises many pairs of bump pad which are connected commonly to an inside circuit(33) and one signal line of the inside circuit and which input and output the same signal. Specifically, the LCD drive IC comprises two or more bump pads to which the same signal is input and from which the same signal is output. Also, the chip on glass module comprises an LCD drive IC, a glass substrate, and an electrode which is formed on a position corresponding to the bump pad of the LCD drive IC on the glass substrate and is contacted with the bump pad to transmit signal. The LCD drive IC also includes many pairs of bump pad which are connected commonly to the inside circuit and one signal line of the inside circuit and which input and output the same signal. Thus, contact resistance between the bump pad and the conductive film pattern of the chip on glass is reduced to prevent LCD from erroneously operating.</p>
申请公布号 KR20000020563(A) 申请公布日期 2000.04.15
申请号 KR19980039229 申请日期 1998.09.22
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, CHEON HO
分类号 H01L23/48;(IPC1-7):H01L23/48 主分类号 H01L23/48
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