CLEANING APPARATUS FOR SEMICONDUCTOR WAFER

摘要

PURPOSE: A semiconductor wafer cleaning apparatus is provided to reduce deformation of a pattern dimension and the surface roughness, and to improve a particle removal capability by reducing the amount of etch of a wafer using bubbles from a gas spray hole. CONSTITUTION: A semiconductor wafer cleaning apparatus includes a cleaning bath(11) onto which a wafer cassette(15) on which a wafer(16) is mounted is loaded. A plurality of outside gas supply tubes(17) provide a gas from the outside to the inside of the cleaning bath(11). A fluid solution supply tube(12) has an inlet(13) for introducing a cleaning solution used in a cleaning process at the bottom of one side of the cleaning bath(11). A supply amount sensor(14) is provided on the upper side of the fluid solution supply tube(12). An internal gas supply tubes(18) has a plurality of bubble spray holes(19). The bubble spray holes(19) are vertically installed on the same position to the outside gas supply tubes(17), within the cleaning bath(16), and spray a gas of the outside gas supply tubes(17).