| 摘要 |
PURPOSE: To manufacture safely a multilayered printed-wring board, which has an IVH and can be thinned, by a method wherein a thermosetting epoxy resin composition which can be subjected to chemical etching after heat-curing, and etching liquid are used for the manufacture of the board. CONSTITUTION: A thermosetting copper-clad bonding resin sheet 2 formed by constituting integrally a copper foil and a thermosetting epoxy resin composition containing epoxy polymer, which is compounded in such a way that bifunctional epoxy resin and bifunctional phenols halide are mixed in the ratio of epoxy group/phenolic hydroxyl group = 1:0.9 to 1.1, has a film formability and has a molecular weight of 100000, as its constituent component is superposed on an internal layer board 1, and the sheet 2 and the board 1 are cured by heating and are bonded together by lamination. An etching resist 4 is formed on the copper foil of the sheet 2 and a fine hole is formed in the copper foil. Then, a cured resin layer under the fine hole is etched away with etching liquid, which consists of amide solvent, an alkaline metal compound and alcoholic solvent, a via hole 5 is opened and a conductor circuit on the board 1 is exposed.
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