SINGULARIZATION METHOD OF BALL GRID ARRAY SEMICONDUCTOR PACKAGE PREPARED USING FLEXIBLE CIRCUIT BOARD

摘要

PURPOSE: A singularization method of ball grid array semiconductor package prepared using flexible circuit board is provided to remove the crack problem generated in singularization process by smoothly isolating a ball grid array semiconductor package without impulse. CONSTITUTION: A singularization method of ball grid array semiconductor package prepared using flexible circuit board comprises a step fixing the top and bottom surfaces of a carrier frame(16) by a supporter(40), a step cutting the edge of a flexible resin film(15) by a cutting and pressing unit(41), a step upwardly bending the carrier frame(16) by upwardly moving the unit(41), and a step isolating a ball grid array semiconductor package(100) from the frame(16).