MULTICHIP MODULE SUBSTRATE AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A method for fabricating a multi chip module substrate is provided to realize a miniaturization of a multi chip module(MCM) by embedding a resistor. CONSTITUTION: A method for fabricating a multi chip module substrate comprises the steps of: forming an oxide film on a base substrate(10); sequentially forming a ground layer(20), a first insulating layer(72), and a power layer(30); wherein the ground layer is configured by piling a first seed metal layer and a first main metal layer, the first insulation film has a first via hole, and the power layer is configured by piling a second seed metal layer and a second main metal layer; forming a second insulation film(74) having a second via hole on the power layer to then form a resistor(100) at a selected portion of the second insulation film; forming on the second insulation film a first signal layer(40) which is connected to both ends of the resistor and is configured by piling a third seed metal layer and a third main metal layer; forming a third insulation film having a third via hole on an entire structure comprising the first signal layer to then form on the third insulating layer a second signal layer(50) which is configured by piling a fourth seed metal layer and a fourth main metal layer; and forming a fourth insulation film having a fourth via hole on an entire structure comprising the second signal layer to then form on the fourth insulating layer a pad layer which is configured by piling a fifth seed metal layer and a fifth main metal layer;