发明名称 |
A METHOD OF FABRICATING A SEMICONDUCTOR DEVICE |
摘要 |
A lead frame is formed by subjecting a frame base to a forming process, a semiconductor chip is fixed on leads formed in the lead frame and wires are provided in the semiconductor chip, and then a package which accommodates the semiconductor chip is formed; a non-conductive adhesive being provided, before the forming process, on a position on the frame base in which the leads are formed, and unnecessary portions of the frame base and the non-conductive adhesive being removed in the forming process so that the leads having a predetermined configuration and provided with the non-conductive adhesive are formed. |
申请公布号 |
KR100252788(B1) |
申请公布日期 |
2000.04.15 |
申请号 |
KR19970002566 |
申请日期 |
1997.01.29 |
申请人 |
FUJITSU LIMITED |
发明人 |
WAKI, MASAKI;HAYASHIDA, KATSUHIRO;SATO, MITSUTAKA;UNO, TADASHI;MITOBA, KAZUHIKO;FUJISAWA, TETSUYA |
分类号 |
H05K1/18;H01L21/60;H01L23/495;H01L23/50 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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