| 摘要 |
PURPOSE: A semiconductor package is disclosed which adopts a fan-out type in addition to a fan-in type micro ball grid array semiconductor package to apply both fan-in and fan-out. CONSTITUTION: A semiconductor package comprises (a) a semiconductor chip(1) on which electronic circuit is integrated and in which a pad(11) for drawing signal is arranged outward on top surface, (b) a microfilm(2) which is bonded to top surface of the semiconductor chip and on surface of which circuit pattern is formed, outside end part of the circuit pattern being formed of a fan-in tap lead(22) connected to the pad of the semiconductor chip, the fan-in tap lead being connected to a fan-in type solder ball land(23) arranged in array type in central part, a fan-out tap lead(24) being formed between the fan-in tap leads, a fan-out type solder ball land(25) being formed outside of the fan-in tap lead and connected to the fan-out tap lead, (c) a solder ball(3) fused to the fan-in type solder ball land and the fan-out type solder ball land, and (d) a resin material(4) for protecting the fan-in tap lead and the fan-out tap lead parts of the micro film bonded to the pad of the semiconductor chip. Thus, by adding fan-out type to the fan-in type, number of the solder ball is increased to receive all signals of high integrated semiconductor chip.
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