| 摘要 |
PURPOSE: A heat dissipating plate for a semiconductor package and an associated process are provided to improve reliability of the package by securing an insulating property of the heat dissipating plate and preventing a crack in the package. CONSTITUTION: The heat dissipating plate such as a heat spreader or a heat sink(31) is made by a die casting method instead of a conventional stamping method. Aluminum, copper, or alloys thereof are used for the heat dissipating plate. A surface of the heat dissipating plate is oxidized to have a nonconducting property. Next, the heat dissipating plate is provided in a mold die, and a lead frame(32) on which a chip(34) is attached and wire-bonded is mounted closely thereto. Then, mold compound is injected into the mold die and thereby the package is molded. When the heat sink(31) is used as the heat dissipating plate, a lower surface of the heat sink(31) is exposed to a bottom of the package.
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